Process for producing circuit board

Details Process for producing circuit board Process for producing circuit board

2006-10-17

2008-10-28

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S852000

Reexamination Certificate

active

07441330

ABSTRACT:
A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.

REFERENCES:
patent: 6429942 (2002-08-01), Soares
patent: 6869750 (2005-03-01), Zhang et al.
patent: 2004/0211751 (2004-10-01), Shuto et al.
patent: 2004-235323 (2004-08-01), None

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