Process for producing ceramic substrates for electronic circuits

Details Process for producing ceramic substrates for electronic circuits Process for producing ceramic substrates for electronic circuits

1978-06-02

1979-06-26

Arnold, Donald J.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 61, 264 66, 264 67, 264148, C04B 3332, C04B 3564

Patent

active

041592956

ABSTRACT:
A substantially homogeneous ceramic mass comprised of about 48 to 88 wt. % of alumina; about 4 to 12 wt. % of polyvinyl butyral; about 0.5 to 5 wt. % of polypropylene oxide - ethylene oxide block polymer; about 3 to 10 wt. % of a polymer solution comprised of acrylic acid esters, methacrylic acid esters and mixed polymers thereof; about 3 to 10 wt. % of a polyvalent alcohol and mixtures of such alcohols; about 1 to 5 wt. % of triethylene glycol and about 0.5 to 10 wt. % of water is produced and vacuum-extruded into an endless relatively flat strip, dried to a green state, shaped into a desired substrate shape and, if to be used with thin layer circuits, subjected to a plane-parallel pressure of about 9,000 to 12,000 N/cm.sup.2 and then fired or sintered into rigid ceramic substrates.

REFERENCES:
patent: 2952877 (1960-09-01), Park, Jr.
patent: 2966719 (1961-01-01), Park, Jr.
patent: 3485288 (1969-12-01), Zusman et al.
patent: 3943216 (1976-03-01), Bakker
patent: 4009238 (1977-02-01), Neidermeier

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