Process for producing ceramic circuit structures having conducti

Details Process for producing ceramic circuit structures having conducti Process for producing ceramic circuit structures having conducti

1992-12-17

1994-08-16

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 264 61, 428901, H01K 310

Patent

active

053374754

ABSTRACT:
Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

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patent: 5133120 (1992-07-01), Kawakami et al.
IBM Technical Disclosure Bulletin vol. 10, No. 11, Apr. 1968, pp. 1663-1664 by D. A. Chance et al.

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