Process for producing cathodes for cathodic sputtering based on

Metal treatment – Process of modifying or maintaining internal physical... – With casting or solidifying from melt

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148437, 148695, 148698, 20429813, C22F 104, C23C 1400

Patent

active

051603888

ABSTRACT:
The invention relates to a process for the production of targets to be used in the vacuum deposition of aluminium alloy by cathodic sputtering.
The process consists of a heat treatment of the aluminium alloy disks making it possible to obtain a fine grain. It is characterized by the dissolving of the silicon, followed by controlled cooling bringing about the fine precipitation of the silicon and an optional silicon spheroidization treatment. After cooling, the disks are deformed with the press and undergo a final recrystallization treatment.
The process is applied to the production of targets or cathodes for the coating of semiconductor silicon wafers by cathodic sputtering.

REFERENCES:
patent: 4797164 (1989-01-01), Hollrigl et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for producing cathodes for cathodic sputtering based on does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing cathodes for cathodic sputtering based on , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing cathodes for cathodic sputtering based on will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2048031

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.