Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1981-06-30
1983-10-04
Morgenstern, Norman
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 96, 427123, 4271262, 427305, 4273763, 4273833, 4273835, 427404, 4274192, B05D 512
Patent
active
044078609
ABSTRACT:
A method of providing a stress-free metal layer by electroless plating techniques, including the steps of (1) providing a substrate that includes some glass material in at least the surface areas to receive a metal layer, (2) depositing a layer of metal-boron by electroless plating techniques, and (3) heating the resultant metal-boron layer in a non-reacting and/or H.sub.2 environment at a temperature of at least 750.degree. C. for a time sufficient to diffuse the boron to the glass material in the substrate.
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patent: 3539391 (1970-11-01), Lepiane
patent: 3579375 (1971-05-01), Wonilowicz
patent: 3632436 (1972-01-01), Denning
patent: 3962143 (1976-06-01), Hitch et al.
patent: 4055706 (1977-10-01), Galmiche et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4349585 (1982-09-01), Nagashima
Stelmak, IBM Tech. Dis. Bul., vol. 20, No. 7, Dec. 1977.
Haddad, IBM TDB, vol. 16, No. 4, Sep. 1973, p. 1282.
Haddad et al., IBM TDB, vol. 21, No. 6, Nov. 1978, p. 2316.
Harvilchuck et al., IBM TDB, vol. 19, No. 11, Apr. 1977, p. 4158.
Fleming Rebecca P.
Lawhorne, Jr. Samuel
Mele John J.
Prasad Chandrika
Bueker Richard
International Business Machines - Corporation
Morgenstern Norman
Stoffel Wolmar J.
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