Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-01-20
1996-04-16
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 39, 216 41, 257759, H01B 1300, B44C 122, C23F 100
Patent
active
055074030
ABSTRACT:
An electronic part is produced by forming two metallic wiring films of different materials on a main substrate, where a first metallic wiring film is formed on the main substrate, a protective film is formed in desired regions on the main substrate and the first metallic wiring film, and a second metallic wiring film is formed on the first metallic wiring film. The thus produced electronic part has an insulating protective film between the first and second metallic wiring films. By the presence of the protective film the surface of the first metallic wiring film is protected from etching, corrosion or deterioration by an agent for patterning the second metallic wiring film.
REFERENCES:
patent: 4713494 (1987-12-01), Oikawa et al.
Sakemura Yukio
Usui Mitsuru
Watanabe Tetsuya
Hitachi , Ltd.
Powell William
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