Process for producing a tin/lead alloy solder joint with less we

Details Process for producing a tin/lead alloy solder joint with less we Process for producing a tin/lead alloy solder joint with less we

1982-03-25

1985-01-29

Ramsey, Kenneth J.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228220, 228223, B23K 102

Patent

active

044960980

ABSTRACT:
Surfaces of copper or brass which are to be joined by tin/lead alloy soldering in a non-oxydizing atmosphere are first wetted by a treating liquid containing an organic solvent typified by ethyl alcohol; a polyhydric alcohol derivative typified by ethylene glycol; and an organic, halogen-containing activator typified by aniline hydrochloride. In the resulting soldered joint, the solder has spread acceptably well and little oxidation or wetting agent resident is formed.

REFERENCES:
patent: Re30696 (1981-08-01), Arbib et al.
patent: 2700628 (1955-01-01), Rosa et al.
patent: 3436278 (1969-04-01), Poliak
patent: 4180419 (1979-12-01), Thompson, Jr.
patent: 4342606 (1982-08-01), Notton
Welding Handbook, vol. 2, Seventh Ed., (1978), pp. 654-655.

Affiliated with

Also associated with

Rating

Process for producing a tin/lead alloy solder joint with less we does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing a tin/lead alloy solder joint with less we, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing a tin/lead alloy solder joint with less we will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-502513