Process for producing a silicized silicon carbide dipping former

Details Process for producing a silicized silicon carbide dipping former Process for producing a silicized silicon carbide dipping former

1990-01-30

1993-03-16

Woo, Jay H.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 86, 264227, 427294, C04B 3564

Patent

active

051942046

ABSTRACT:
A process for making a ceramic dipping former from silicized silicon carbide by making an absorbent negative mold of the ceramic dipping former containing preparing a suspension containing at least two particle size fractions of silicon carbide, a binder and water and pouring the suspension into the absorbent negative mold, drying the suspension in the absorbent negative mold, opening the absorbent negative mold and removing a silicon carbide green body, and further drying and silicizing the green body in a drying oven at a temperature between approximately 1400.degree. C. to 1750.degree. C. under reduced pressure.

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