Process for producing a silica sintered product for a multi-laye

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Involving specified composition of heating atmosphere – other...

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Details

264650, 264681, 501154, C04B 3564, C04B 3514

Patent

active

057141126

ABSTRACT:
A process for producing a silica sintered product for a multi-layer wiring substrate of the invention includes: providing a fine silica powder having an average particle size of 5 to 500 nm and a fine crystallized quartz powder having an average particle size 1 to 10 .mu.m, the fine crystallized quartz powder having a volume equal to 1 to 20% of the entire volume of the fine silica powder and the fine crystallized quartz powder; mixing the fine silica powder and the fine crystallized quartz powder with a binder and a solvent to form a silica-containing slurry; forming a green sheet by slip-casting the silica-containing slurry; and firing the green sheet at a temperature of 800.degree. to 1200.degree. C. in an atmosphere containing steam at a partial pressure of 0.005 to 0.85 atm.

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