Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1997-05-22
2000-07-04
Ryan, Patrick
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2282481, 29612, 29620, B23K 3102, B23K 3100, H01C 702, H01C 1706
Patent
active
060826096
ABSTRACT:
A process is provided for producing a sensor arrangement for measuring temperature with a temperature-sensitive measuring resistance element which has a thin, metallic resistance layer electrically-insulated toward the outside on a ceramic substrate and free-lying contact surfaces, which are connected electrically-conducting and directly mechanically fast with high-temperature-resistant conductor strips, electrically insulated from one another, on a ceramic board. The measuring resistance element is bonded and fastened on one end of the board by laying it on a still moist thick-film conducting paste printed on immediately before outfitting on the board and subsequently burning it in. On the end of the board away from the measuring resistance element, contact surfaces for connection of a plug or cable are arranged. The temperature sensor, a standard component in the form of a flat measuring resistance element, is applied wirelessly as an SMD component on the ceramic board. The sensor arrangement manufactured with the process is suited for temperature measurements above 400.degree. C. as well. The process is economical in using only a few standardized components and easily automatable process steps.
REFERENCES:
patent: 3818415 (1974-06-01), Evans et al.
patent: 4031272 (1977-06-01), Khanna
patent: 4375056 (1983-02-01), Baxter et al.
patent: 4447799 (1984-05-01), Carlson
patent: 4547436 (1985-10-01), Rellick
patent: 4567110 (1986-01-01), Jarvinen
patent: 4843190 (1989-06-01), Verhoeven
patent: 5033666 (1991-07-01), Keusseyan et al.
patent: 5248079 (1993-09-01), Li
patent: 5252219 (1993-10-01), Nakatani et al.
patent: 5252519 (1993-10-01), Nakatani et al.
patent: 5400953 (1995-03-01), Maeno
patent: 5494562 (1996-02-01), Maley et al.
Yoshiki (Patent Abstracts of Japan) Electronic Clinical Thermometer and Manufacture Thereof May 11, 1985 #60082824.
Hajime (Patent Abstracts of Japan) Manufacture of Hybrid Integrated Circuit Device Sep. 21, 1983 #58158980.
Bargel and Schulz, Werkstofftechnik, p. 88.
Hawley, Gessner G. (ed.), The Condensed Chemical Dictionary, 10th ed., pp. 147 and 957. (1981).
Muziol Matthias
Soll Eva
Wienand Karlheinz
Heraeus Electro-Nite International N.V.
Ryan Patrick
Stoner Kiley
LandOfFree
Process for producing a sensor arrangement for measuring tempera does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for producing a sensor arrangement for measuring tempera, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing a sensor arrangement for measuring tempera will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1478565