Process for producing a semiconductor package

Details Process for producing a semiconductor package Process for producing a semiconductor package

1996-09-13

1998-09-08

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438111, H01L 7144

Patent

active

058044221

ABSTRACT:
A semiconductor package is produced by the following steps. A plurality of circuit boards are prepared, each board having an opening for forming a cavity and a surface providing with a circuit pattern having bonding sections at a peripheral area of the opening. The bonding sections of the respective circuit boards are covered with protective films. A laminated body is formed by laminating the plurality of circuit boards by means of adhesive sheets arranged between the respective circuit boards. Upper and lower substrates are also laminated on upper and lower surfaces of the plurality of circuit boards, respectively, by means of adhesive sheets to close the cavity. The protective films are subsequently removed from the bonding sections of the respective circuit boards of the laminated body.

REFERENCES:
patent: 5205036 (1993-04-01), Yamazaki
patent: 5227583 (1993-07-01), Jones
patent: 5240588 (1993-08-01), Uchida
patent: 5474957 (1995-12-01), Urushima
patent: 5702985 (1997-12-01), Burns

Affiliated with

Also associated with

Rating

Process for producing a semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing a semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing a semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1281215