Process for producing a semiconductor device using anisotropic c

Details Process for producing a semiconductor device using anisotropic c Process for producing a semiconductor device using anisotropic c

1997-07-16

1999-06-29

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438118, 438113, 438108, 438455, 438458, 438460, 438462, 438464, H01L 2144, H01L 2148, H01L 2150

Patent

active

059181133

ABSTRACT:
A process for producing a semiconductor device includes a step of forming an anisotropic conductive adhesive layer, which includes a thermoplastic or thermosetting resin and conductive powder dispersed therein, on a surface of a circuit board on which electrode terminal contacts are arranged so as to correspond to electrode terminals of a semiconductor chip which is to be mounted on said circuit board. Then, the anisotropic conductive adhesive layer is softened and the semiconductor chip is placed in such a manner that the electrode terminals coincide with the electrode terminal contacts through the anisotropic conductive adhesive layer. The semiconductor chip is heat-pressed against the circuit board so that the electrode terminals are electrically connected to the electrode terminal contacts and simultaneously the semiconductor chip is physically fixed to the circuit board when the anisotropic conductive adhesive layer is hardened.

REFERENCES:
patent: 5118370 (1992-06-01), Ozawa
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5323051 (1994-06-01), Adams et al.
patent: 5352318 (1994-10-01), Takabayashi et al.
patent: 5604160 (1997-02-01), Warfield
patent: 5661042 (1997-08-01), Fang et al.

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