Process for producing a semiconductor device having hemispherica

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

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438238, 438239, 438255, 438444, 438488, H01L 2120

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active

061402044

ABSTRACT:
Ingredient gas is first supplied into a reacting section disposed in an apparatus for chemical vapor deposition. Subsequently, a silicon film is deposited on a wafer under a condition that temperature at the upstream side of a direction of the ingredient gas flow inside the reacting section is higher than that at the downstream side thereof.

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Watanabe, et al. "Device application and structure observation for hemispherical-grained Si" Journal of Applied Physics, vol. 71, n. 7, pp. 3538-3543 (1992).

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