Process for producing a semiconductor device having an identific

Metal working – Method of mechanical manufacture – Assembling or joining

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156601, 156626, 250548, 250557, 250568, 2504922, 235469, 235491, 3401463B, 3401463Z, 356402, 427 10, H01L 2166, H01L 2184

Patent

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043488030

ABSTRACT:
In a process for producing a semiconductor device using an insulating substrate, a so called SOS device, a semiconductor layer is formed on the insulating film and semiconductor elements are formed in the semiconductor layer, material, which develops color with in the insulating substrate, is introduced in the substrate, and a color developed part of the insulating substrate is used as an identification mark of the substrate and the semiconductor elements. Cracking of the substrates due to formation of the identification mark is prevented.

REFERENCES:
patent: 3513320 (1970-05-01), Weldon
patent: 3679497 (1972-07-01), Handy et al.
patent: 3710101 (1973-01-01), O'Keeffe et al.
patent: 4037969 (1977-07-01), Feldman et al.
patent: 4105926 (1978-08-01), Reno et al.
patent: 4125418 (1978-11-01), Vinton
patent: 4200393 (1980-04-01), Suzuki et al.
patent: 4202491 (1980-05-01), Suzuki
patent: 4203799 (1980-05-01), Sugawara et al.
Denning, P. A., "Automatic Alignment . . . Wafer Fabrication" Solid State Technology, May 1976, pp. 43-47.

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