Process for producing a semiconductor device

Details Process for producing a semiconductor device Process for producing a semiconductor device

2007-06-19

2007-06-19

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000

Reexamination Certificate

active

11012377

ABSTRACT:
The process for producing a semiconductor device according to the invention comprises a pre-sticking/fixing step of pre-sticking/fixing a semiconductor element through an adhesive sheet to an object to which the semiconductor element is to be stuck/fixed, and a wire bonding step of performing wire bonding without heating step, wherein the shear adhesive force of the adhesive sheet to the object is 0.2 MPa or more at the time of the pre-sticking/fixing. This makes it possible to a semiconductor device producing process wherein a drop in the yield of semiconductor devices is suppressed and steps therein are made simple; an adhesive sheet used in this process; and a semiconductor device obtained by the process.

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Japanese Office Action issued on the corresponding Japanese Patent Application No. 2003-423118, dated Jan. 29, 2007.

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