Process for producing a semiconductor device

Details Process for producing a semiconductor device Process for producing a semiconductor device

2007-01-30

2007-01-30

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S113000, C438S114000, C438S464000, C438S465000

Reexamination Certificate

active

10916177

ABSTRACT:
A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.

REFERENCES:
patent: 6972249 (2005-12-01), Akram et al.
patent: 2001/0014492 (2001-08-01), Noguchi et al.
patent: 2001/0036711 (2001-11-01), Urushima
patent: 2005/0009241 (2005-01-01), Nakata et al.
patent: 2001-144140 (2001-05-01), None

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