Process for producing a printed wiring board

Details Process for producing a printed wiring board Process for producing a printed wiring board

1992-10-28

1993-10-12

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C25D 502

Patent

active

052521958

ABSTRACT:
A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the copper-clad laminate; removing the first resist pattern; subjecting the whole laminate to an electroless copper plating; laminating a dry film resist on the copper-clad laminate; exposing and developing the dry film resist to form a second resist pattern in such a manner that the through-hole and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating; removing the second resist pattern; and removing the exposed electroless copper plating through etching.

REFERENCES:
patent: 3208921 (1965-09-01), Hill
patent: 3475284 (1969-10-01), Olson
patent: 3568312 (1971-03-01), Perricone
patent: 3832176 (1973-04-01), Verstraete et al.
Patent Abstracts of Japan, vol. 14, No. 22 (E-8744)(3965), Jan. 17, 1990 & JP-A-1 264 290 (Hitachi, Ltd), Oct. 20, 1989.

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