Process for producing a package for packing semiconductor device

Details Process for producing a package for packing semiconductor device Process for producing a package for packing semiconductor device

1988-03-14

1989-10-24

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29846, H05K 302

Patent

active

048752843

ABSTRACT:
In a package comprising a chip mounting base and a cap to be fitted on the base, the base comprises a metal substrate, an electrically insulating ceramic layer formed on the metal substrate, a patterned metal layer formed on the ceramic layer in a selected area thereof, a first mixed layer formed in an area near the interface between the metal substrate and the ceramic layer, and a second mixed layer formed in an area near the interface between the ceramic layer and the metal layer, and the cap comprises a metal substrate, an electrically insulating ceramic layer formed in at least the marginal portion of the side of the metal substrate which faces the base, and a mixed layer that is formed in an area near the interface between the metal substrate and the ceramic layer.

REFERENCES:
patent: 4656499 (1987-04-01), Butt

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