Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-09-25
2000-11-07
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156235, 156252, 1562722, 1562739, 29830, 29846, B32B 3112, B32B 3120, B32B 3124, H05K 302
Patent
active
061431168
ABSTRACT:
A multilayer wiring board formed by laminating a plurality of circuit board units each including an insulating board containing at least a thermosetting resin, and a wiring circuit layer formed on the surface of said insulating board, wherein said insulating board is provided with via hole conducting passages so as to electrically connect the wiring circuit layers of the neighboring circuit board units, said via hole conducting passages are formed by filling via holes formed in the insulating board with a conducting paste, and said wiring circuit layer is buried in the surface of the insulating board in a manner that said insulating board possesses a flat surface. The multilayer wiring board has a satisfactory flatness required for mounting flip chips. Besides, the insulating board and the via hole conducting passages are not infiltrated by chemicals such as etching solution or plating solution. There is no problem of defective circuit, and connection is highly reliably maintained offering advantage in realizing a highly dense wiring.
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Fukumoto Shigeaki
Hayashi Katsura
Hiramatsu Yukihiro
Iino Yuji
Nishimoto Akihiko
Kyocera Corporation
Mayes Curtis
LandOfFree
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