Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Reexamination Certificate
2006-01-10
2006-01-10
McNeil, Jennifer (Department: 1775)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
C428S141000, C428S206000, C428S209000, C427S123000, C427S203000, C427S404000, C427S437000, C264S211140, C264S211120
Reexamination Certificate
active
06984446
ABSTRACT:
Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
REFERENCES:
patent: 2897409 (1959-07-01), Gitto
patent: 3391455 (1968-07-01), Hirohata et al.
patent: 3506482 (1970-04-01), Hirohata et al.
patent: 3574068 (1971-04-01), Chessin
patent: 4411980 (1983-10-01), Haney et al.
patent: 4454168 (1984-06-01), Fritz
patent: 4560445 (1985-12-01), Hoover et al.
patent: 5421989 (1995-06-01), Stamp et al.
patent: 6171468 (2001-01-01), Thorn et al.
patent: 6414596 (2002-07-01), Altwasser et al.
patent: 2005/0034995 (2005-02-01), Gunlach et al.
patent: 448 210 (1927-08-01), None
patent: 196 29 269 (1998-01-01), None
patent: 196 39 232 (1998-03-01), None
patent: 196 39 646 (1998-04-01), None
patent: 198 06 360 (1998-09-01), None
patent: 198 10 809 (1999-12-01), None
patent: 198 33 593 (2000-01-01), None
patent: 198 41 804 (2000-03-01), None
patent: 0 570 062 (1993-11-01), None
patent: 0 647 729 (1995-04-01), None
patent: 0 726 337 (1996-08-01), None
patent: 0 913 711 (1999-05-01), None
patent: 2 087 654 (1982-05-01), None
patent: WO-92/19092 (1992-10-01), None
patent: WO-92/21118 (1997-06-01), None
patent: WO-99/65002 (1999-12-01), None
patent: WO-01/54226 (2001-07-01), None
“Additive Plating for Thermoplastic Carriers”; Research Disclosure, Kenneth Mason Publication, Hampshire, GB, Nr. 314, Jun. 1, 1990, p. 459, XP.
Gundlach Harald
Muller-Hipper Andreas
Simmerlein-Erlbacher Ewald
Darby & Darby
Infineon - Technologies AG
McNeil Jennifer
Savage Jason L.
LandOfFree
Process for producing a metal layer on a substrate body, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for producing a metal layer on a substrate body, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing a metal layer on a substrate body, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3537732