Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2000-02-07
2001-03-27
Talbot, Brian K. (Department: 1762)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097100, C101S129000
Reexamination Certificate
active
06207221
ABSTRACT:
BACKGROUND OF THE INVENTION
The invention relates to a process for producing a ceramic-metal substrate for electrical circuits.
Production of a metal coating necessary for producing printed conductors, terminals, etc., on a ceramic using the so-called DCB process (direct copper bond technology) is known. Copper foils are oxidized on their surfaces and form the metal coating. The copper oxide layer of these foils forms a eutectic with a melting point below the melting point of the copper, so that by applying the foils to the ceramic and by heating all the layers they can be joined to one another, by melting on the copper in the area of the oxide layer. The DCB process is a technique known to one skilled in the art which has the following process steps:
oxidation of a copper sheet such that a uniform copper oxide layer forms;
placing the copper sheet on the ceramic layer;
heating the combination to roughly 1071° C., for example;
cooling to room temperature.
The object of the invention is to devise a production process with which it is possible to produce metal-ceramic substrates for electric power circuits economically and also with optimum thermal properties.
SUMMARY OF THE INVENTION
In the substrates produced using the process as claimed in the invention, the second metal coating is produced using thick film or thin film technology. The second metal coating can be an intermediate layer which provides an improved thermal/or electrical transition between the ceramic layer and a metal base plate on which the substrate is located. The base plate is connected to a cooling body or a heat sink or can be a component of a heat sink. The connection between the substrate and the base plate can be a soldered connection. It is also possible to produce this connection by brazing. In the invention, the first metal coating is produced using DCB technology. The first metal coating forms the printed conductor contact surfaces, etc. and depending on the desired component can be textured.
REFERENCES:
patent: 4959507 (1990-09-01), Tanaka et al.
patent: 5317801 (1994-06-01), Tanaka et al.
patent: 5561321 (1996-10-01), Hirano et al.
patent: 5676855 (1997-10-01), Schulz-Harder
Hoffman Wasson & Gitler
Talbot Brian K.
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