Process for producing a heat sink fin

Details Process for producing a heat sink fin Process for producing a heat sink fin

1994-11-01

1996-05-28

Vo, Peter

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

29727, 125 21, 451296, B23P 1526, B24B 2112, B28D 108, H01L 23367

Patent

active

055199380

ABSTRACT:
A fin assembly for use as a heat sink and production thereof are disclosed. The fin assembly comprises a plurality of heat dissipating plates formed by means of a multi-wire saw, and the heat dissipating plates each has a thickness of no more than 1 mm and being spaced apart by a gap of no more than 1.5 mm.

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Chao et al., Eight Annual IEEE Semiconductor Thermal Measurement And Management Symposium, Feb. 1992, pp. 97-100.
Electronics International, "Grooved Substrate Boosts IC Cooling," S. W. Fields, vol. 55, No. 17, Aug. 1982, pp. 46-48.

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