Process for producing a film carrier having a superior lead stre

Metal working – Method of mechanical manufacture – Electrical device making

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179 524, 437206, H01R 4300

Patent

active

052242641

ABSTRACT:
A process for producing a film carrier having a superior lead strength, which comprises removing from a film carrier body of a two-layer structure consisting of a metal conductor layer and an organic resin insulating layer snch as a polyimide resin layer, a definite portion of the organic resin insulating layer, or alternatively removing from a film carrier body of a three-layer structure consisting of a metal conductor layer, an organic resin insulating layer and an adhesive layer therebetween, definite portions of the organic resin insulating layer and the adhesive layer, by means of a cutting machine, to form an opening part, and also cutting a portion of the metal conductor layer under the opening part, to reduce the thickness of the metal conductor layer.

REFERENCES:
patent: 3984739 (1976-10-01), Mochizuki et al.
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4812421 (1989-03-01), Jung et al.
patent: 5112694 (1992-05-01), Konotsune et al.

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