Metal fusion bonding – Process – Diffusion type
Patent
1995-07-11
1997-04-15
Ramsey, Kenneth J.
Metal fusion bonding
Process
Diffusion type
228174, 22826242, B23K 2000
Patent
active
056201303
ABSTRACT:
A die plate for the underwater granulation of thermoplastic material is formed with a base plate of an iron alloy, a hard annular cutting plate of titanium-carbide alloy, and an intermediate buffer layer containing nickel between the base plate and the cutting plate to equilibrate heat stresses due to different coefficient of thermal expansion of the base and the cutting plates. The intermediate layer is formed with a thickness of between 0.5 and 2 mm by hot-isostatic pressing a nickel-containing metal powder between the plates such that the intermediate layer is diffusion welded to the plates. Two nickel layers with an intermediate titanium-containing plate can also be formed. Also an ansenitic layer can be formed between the nickel layer and the base plate.
REFERENCES:
patent: 3271822 (1966-09-01), Rhino
patent: 3599286 (1971-08-01), Karet
patent: 3905743 (1975-09-01), Bagley
patent: 5054682 (1991-10-01), Mistry
Schneider Friedrich
Worz Wolfgang
Ramsey Kenneth J.
Werner & Pfleiderer GmbH
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