Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1989-05-01
1991-09-17
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156233, 156239, 156241, 156630, 204 12, 204281, C25D 508
Patent
active
050492217
ABSTRACT:
A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several micrometers on a planar conductive substrate by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive substrate on an insulating substrate and tightly integrating the assembly by applying pressure and heat, and a step (S5) of separating only the conductive substrate. A metal film may exist between the conductive substrate and the copper foil. When the metal film has a thickness of 0.1 to 3 .mu.m, only the conductive substrate is separated with the metal film being firmly adhered to the copper foil surface and, when the metal film has a thickness of 70 to 250 .mu.m, it is separated together with the conductive substrate after the lamination. The copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm.sup.2 in current density has about the same flexibility as that of rolled and annealed copper. Thus, ultrathin copper-clad laminates with a copper foil of 10 .mu.m or less suited for flexible circuit boards can be produced in a short time using small equipment.
REFERENCES:
patent: 1589564 (1926-06-01), Robinson
patent: 4053370 (1977-10-01), Yamashita et al.
patent: 4240894 (1980-12-01), Adler
patent: 4503112 (1985-03-01), Konicek
patent: 4715116 (1987-12-01), Thorpe et al.
Touyama Tasuku
Wada Tatsuo
Yamamoto Teruaki
Yamashita Keizo
Gallagher John J.
Meiko Electronics Co., Ltd.
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