Process for producing a component module

Details Process for producing a component module Process for producing a component module

2007-05-01

2007-05-01

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257S680000, C257S787000, C257SE23066, C257SE23116, C257SE21525, C716S030000, C250S231130, C438S460000, C438S464000

Reexamination Certificate

active

10298772

ABSTRACT:
A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps:arranging separated components on a surface-adhesive film at a predefined contact-specific spacing from one another,embedding the components in a flexible material in order to form a flexible holding frame which holds the components,pulling off the film,producing contact-making elements on the exposed side of the components,performing a functional test of the components and, if necessary, repair and/or replacement of components, andfixing and making contact with the components held in the holding frame on the module carrier.

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“Simple Device for Removing Chips from Decal,” IBM Technical Disclosure Bulletin, IBM Corp (USA), vol. 30 (No. 11), p. 240-241, (Apr. 1988).

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