Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-02-03
2000-05-23
Dixon, Merrick
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 8918, 156 8916, 1563071, 228122, 228124, 228198, 228219, 427 96, 427 99, 427123, 4271263, C03B 2900
Patent
active
060662190
ABSTRACT:
The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.
REFERENCES:
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4950558 (1990-08-01), Sarin
patent: 5049408 (1991-09-01), Klinedinst et al.
patent: 5217589 (1993-06-01), Arledge et al.
patent: 5382471 (1995-01-01), Arledge et al.
patent: 5418002 (1995-05-01), Paik et al.
No. 3-103370(A) "Method For Modifying Surface And Cementing Of Ceramic Substrate"--Patents Abstracts of Japan, C-852 Jul. 23, 1991 vol. 15/No. 289.
JP94045509--Abstract "Surface Modified Aluminum Nitride Ceramic Substrate For Cementing Copper Plate To Surface Modified Aluminum Nitride Subtrate".
Exel Karl
Schmidt Karsten
Schulz-Harder Jurgen
Curamik Electronics GmbH
Dixon Merrick
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