Process for producing a ceramic substrate and a ceramic substrat

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 8918, 156 8916, 1563071, 228122, 228124, 228198, 228219, 427 96, 427 99, 427123, 4271263, C03B 2900

Patent

active

060662190

ABSTRACT:
The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

REFERENCES:
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4950558 (1990-08-01), Sarin
patent: 5049408 (1991-09-01), Klinedinst et al.
patent: 5217589 (1993-06-01), Arledge et al.
patent: 5382471 (1995-01-01), Arledge et al.
patent: 5418002 (1995-05-01), Paik et al.
No. 3-103370(A) "Method For Modifying Surface And Cementing Of Ceramic Substrate"--Patents Abstracts of Japan, C-852 Jul. 23, 1991 vol. 15/No. 289.
JP94045509--Abstract "Surface Modified Aluminum Nitride Ceramic Substrate For Cementing Copper Plate To Surface Modified Aluminum Nitride Subtrate".

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