Process for pretreatment before plating through-holes of printed

Details Process for pretreatment before plating through-holes of printed Process for pretreatment before plating through-holes of printed

1987-04-02

1988-11-01

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, 134 221, 134 31, B05D 512

Patent

active

047819430

ABSTRACT:
A pretreatment process for removing air within through-holes of printed circuit boards before plating the through-holes is provided. Air within the through-holes of the printed circuit boards is replaced with a saturated vapor of a water-soluble liquid by dipping the printed circuit board into the boiled liquid and then the saturated vapor is dissolved in water or a water-soluble liquid to remove air.

REFERENCES:
patent: 3755890 (1973-09-01), Klehm
patent: 4155775 (1979-05-01), Alpangh
patent: 4398993 (1983-08-01), Hume
patent: 4544439 (1985-10-01), Soloman
patent: 4639380 (1987-01-01), Amelio
patent: 4668532 (1987-05-01), Moisan
patent: 4701352 (1987-10-01), DeLuca
Pridans et al., "Method for Through-Hole Plating Void Elimination" IBM TDB, vol. 21, No. 6, Nov. 1978, p. 2267.

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