Process for pretreating polyamide substrates for electroless met

Details Process for pretreating polyamide substrates for electroless met Process for pretreating polyamide substrates for electroless met

1984-10-29

1985-11-19

Hoffman, James R.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427304, B05D 310

Patent

active

045541833

ABSTRACT:
A mild activation process for the electroless metallization of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl.sub.2) with salts of weak inorganic bases and strong inorganic acids (for example AlCl.sub.3) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial.

REFERENCES:
patent: 4493861 (1985-01-01), Sirinyan et al.

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