Process for preserving the solderability of through hole plated

Details Process for preserving the solderability of through hole plated Process for preserving the solderability of through hole plated

1985-11-04

1987-03-17

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

046505482

ABSTRACT:
A process for preserving over long storage periods the solderability of tin-lead coatings on copper or copper-based alloys on through hole plated printed circuit boards is described in which an intermediate layer of lead is deposited before the deposition of a tin-lead alloy. Printed circuit boards produced in this manner show an improved soldering behavior.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser
patent: 3673680 (1972-07-01), Tanaka
patent: 4525246 (1985-06-01), Needham
Bogenschutz, Oberflachentechnik und Galvanotechnik in der Elektronik, p. 46, 1971.

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