Process for preparing the through hole walls of a printed wiring

Details Process for preparing the through hole walls of a printed wiring Process for preparing the through hole walls of a printed wiring

1989-04-24

1990-01-30

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 20, 204 26, C25D 502, C25D 554

Patent

active

048971642

ABSTRACT:
In the process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps:

REFERENCES:
patent: 4619741 (1986-10-01), Minten et al.
patent: 4622107 (1986-11-01), Piano
patent: 4622108 (1986-11-01), Polakovic et al.
patent: 4631117 (1986-12-01), Minten et al.
patent: 4684560 (1987-08-01), Minten et al.
patent: 4718993 (1988-01-01), Cupta et al.

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