Process for preparing the through hole walls of a printed wiring

Chemistry: electrical and wave energy – Processes and products

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204 20, 204 26, C25D 502, C25D 554

Patent

active

048744778

ABSTRACT:
An improvement to the process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises:

REFERENCES:
patent: 4619741 (1983-10-01), Minten et al.
patent: 4622107 (1986-11-01), Piano
patent: 4622108 (1986-11-01), Polakovic et al.
patent: 4631117 (1986-12-01), Minten et al.
patent: 4634619 (1987-01-01), Lindsay
patent: 4684560 (1987-08-01), Minten et al.
patent: 4718993 (1988-01-01), Cupta et al.
patent: 4724005 (1988-02-01), Minten et al.
Etadurin 21, C, F and 31 Technical Bulletins and Product Data Sheets from Akzo Chemie America (Copyright 1987).
Magnifloc (400 Series) Product Data Sheets from American Cyanamid Co. (Printed 10/86).

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