Process for preparing silica having a low silanol content

Chemistry of inorganic compounds – Silicon or compound thereof – Oxygen containing

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423325, 423340, 156DIG64, C01B 3312

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active

052021041

ABSTRACT:
A process for preparing silica having a low silanol content which comprises heating amorphous silica in an atmosphere of a low partial pressure of water vapor to maintain the amorphous silica at a temperature in a range of from 600.degree. to 1000.degree. C. at a first heating step and then maintain at a temperature of 1200.degree. C. or more at a second heating step. The silica having a low silanol content obtained according to the present invention is advantageously used as a raw material for quartz glass, particularly as a raw material for preparing crucibles used to pull up silicon single crystals.

REFERENCES:
patent: 3859420 (1975-01-01), Laufer et al.
patent: 4683128 (1987-07-01), Orii et al.
Kondo, "Effect of Heat Treatment on Silica Gel", Hymen, 14(8-9) 1976, pp. 419-426, abstract only.
Iler, R. K. The Chemistry of Silica, pp. 638-644 (1979).

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