Process for preparing semiconductor device having active base re

Metal treatment – Compositions – Heat treating

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29571, 29576B, 148187, 357 34, 357 91, H01L 21265, H01L 21225, H01L 2126

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044419325

ABSTRACT:
A process for preparing a semiconductor device having a walled emitter structure covering at least one side surface with a dielectric layer for separation of devices comprises a step of forming a base by implantation of ions with a resist mask for base; a step of forming an emitter by implantation of ions from an emitter-opening part; and a step of formation an active base in a base just below said emitter by implantation of ions from said emitter-opening part.

REFERENCES:
patent: 4066473 (1978-01-01), O'Brien
patent: 4175983 (1979-11-01), Schwabe
patent: 4191595 (1980-03-01), Aomura et al.
patent: 4199380 (1980-04-01), Farrell et al.
patent: 4231819 (1980-11-01), Raffel et al.
patent: 4242791 (1981-01-01), Horng et al.
patent: 4313255 (1982-02-01), Shinozaki et al.
patent: 4333774 (1982-06-01), Kampka
patent: 4338138 (1983-07-01), Cavaliere et al.
patent: 4372030 (1983-02-01), Saitoh
Gaur et al., IBM-TDB, 23, (1980), 1895.
Akasaka et al., Technical Digest of IEDM 1979, p. 189.

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