Metal treatment – Compositions – Heat treating
Patent
1982-03-11
1984-04-10
Roy, Upendra
Metal treatment
Compositions
Heat treating
29571, 29576B, 148187, 357 34, 357 91, H01L 21265, H01L 21225, H01L 2126
Patent
active
044419325
ABSTRACT:
A process for preparing a semiconductor device having a walled emitter structure covering at least one side surface with a dielectric layer for separation of devices comprises a step of forming a base by implantation of ions with a resist mask for base; a step of forming an emitter by implantation of ions from an emitter-opening part; and a step of formation an active base in a base just below said emitter by implantation of ions from said emitter-opening part.
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Akasaka et al., Technical Digest of IEDM 1979, p. 189.
Akasaka Yoichi
Tsukamoto Katsuhiro
Mitsubishi Denki & Kabushiki Kaisha
Roy Upendra
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