Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1980-04-07
1981-12-08
Rutledge, L. Dewayne
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 29583, 29588, 29413, 156645, 156649, 156657, 357 55, 357 56, H01L 2178, H01L 2180
Patent
active
043040438
ABSTRACT:
A process for preparing semiconductor pellets from one sheet of a semiconductor wafer is disclosed. In the process of the invention, the semiconductor wafer is divided into a plurality of pellet-forming regions and reinforcing regions are formed between the pellet forming regions and at the peripheral part of the wafer.
The reinforcing regions prevent breakage of the wafer without increasing the thickness of the pellets whereby a wafer having a large diameter can be used to obtain many pellets having suitable characteristics from one sheet of the wafer without substantial loss.
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Gamo Hiroshi
Hokuyo Shigeru
Ichimura Takahiko
Yamamoto Takeshi
Mitsubishi Denki & Kabushiki Kaisha
Rutledge L. Dewayne
Saba W. G.
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