Process for preparing printed circuit board thru-holes

Details Process for preparing printed circuit board thru-holes Process for preparing printed circuit board thru-holes

1985-07-26

1986-07-01

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156643, 156668, 427 98, 427307, C23C 1822, H05K 342

Patent

active

045979880

ABSTRACT:
The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear from the copper innerlayers, followed by treatment of the hole surfaces with a solvent for the resin, treatment of the hole surfaces with a highly alkaline permanganate solution, and deposition of a conductive metal layer on the hole surfaces.

REFERENCES:
patent: 3725108 (1973-04-01), Saubestre
patent: 4054693 (1977-10-01), Leech
patent: 4425380 (1984-01-01), Nuzzi
patent: 4515829 (1985-05-01), Deckert
Kukanskis, "Improved Smear Removal", Circuits Manufacturing, pp. 73, 74, Mar. 1983.

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