Process for preparing printed circuit board thru-holes

Details Process for preparing printed circuit board thru-holes Process for preparing printed circuit board thru-holes

1986-06-23

1988-07-12

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427306, 427307, 156645, 156668, B05D 512, B05D 301, B05D 310, B29C 3700

Patent

active

047569301

ABSTRACT:
The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear from the copper innerlayers, followed by treatment of the hole surfaces with a solvent for the resin, treatment of the hole surfaces with a highly alkaline permanganate solution, and deposition of a conductive metal layer on the hole surfaces.

REFERENCES:
patent: 3725108 (1973-04-01), Saubestre
patent: 3865623 (1975-02-01), Allen
patent: 4054693 (1977-10-01), Leech
patent: 4425380 (1984-01-01), Nuzzi
patent: 4515829 (1985-05-01), Deckert
patent: 4597988 (1986-07-01), Kukanskis
Kukanskis, "Improved Smear Removal", Circuits Manufacturing, pp. 73, 74, Mar. 1983.
Blanchette et al., "Smear Removal from Drilled Printed Circuit Boards", IBM TDB, vol. 23, No. 10, Mar. 1981.

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