Process for preparing polymeric materials for application to pri

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156231, 156238, 156248, 156267, 156660, 428202, 427 96, B44C 117, B44C 122, B32B 3100

Patent

active

048348210

ABSTRACT:
A process for preparing curable, aqueous strippable, polymeric materials for application, in succession, as masks, to a specific area of each of a plurality of printed circuit boards that is to be protected from the stripping and plating processes associated with gold finger plating, during the fabrication thereof, includes forming a coating of substantially identical, uniformly spaced, areas of polymeric material on a continuous length of carrier web, applying a cover coating over the carrier web and the uniformly spaced areas of polymeric material with the cover coating having a width substantially the same as that of the carrier film, and winding up in a roll the continuous length of carrier web and the cover coating with the uniformly spaced polymeric material sandwiched therebetween.

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