Process for preparing polyimide composites

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156286, 1563311, 427375, 4284735, 528348, C09J 502

Patent

active

050592734

ABSTRACT:
Low void composites with high Tg polyimide matrices are prepared from stoichiometrically unbalanced precursors.

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