Process for preparing phenolepoxy resins in the absence of an aq

Details Process for preparing phenolepoxy resins in the absence of an aq Process for preparing phenolepoxy resins in the absence of an aq

1997-04-29

1998-12-01

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

549517, C08G 5906, C08G 5908

Patent

active

058440623

ABSTRACT:
A process for preparing phenolepoxy resin represented by the following formula: ##STR1## wherein: (a) R.sup.1, R.sup.2, R.sup.3, and R.sup.4, which can be the same or different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; (b) R.sup.5 and R.sup.6, which can be the same or different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; ##STR2## (c) R.sup.7 is hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; (d) R.sup.8 and R.sup.9, which can be the same of different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; and (e) n is an integer of 0 or 1. The phenolepoxy resin can be advantageously used in making packaging materials for ICs, as a substrate additive for printed circuit boards, and as adhesive for the electronic industry. The process includes the steps of preparing a reaction medium which contains only polyphenol, epihalohydrinl and an imidazole catalyst, and then causing the reaction medium to react in the absence of an aqueous phase.

REFERENCES:
patent: 2943096 (1960-06-01), Reinking
patent: 4582892 (1986-04-01), Chang et al.
patent: 5278260 (1994-01-01), Schaffner et al.

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