Process for preparing metallized polyimide film

Details Process for preparing metallized polyimide film Process for preparing metallized polyimide film

1990-11-15

1992-07-14

Lusignan, Michael

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

427209, 427250, 427304, 427306, 427316, 4273831, 427404, 4274431, 428458, B32B 1508

Patent

active

051301920

ABSTRACT:
A process for preparing a metallized polyimide film, comprising the steps of: forming a solidified film containing 100 parts by weight of an aromatic polyamic acid in the form of a solution obtained by polymerizing approximately equal moles of an aromatic tetracarboxylic acid component and an aromatic diamine component and 5 to 150 parts by weight of an organic polar solvent; applying a surface treatment solution containing a heat-resistant surface treating agent to the surface of the solidified film; heating the solidified film to a high temperature to imidize the polyamic acid, while drying the film to prepare a polyimide film; forming a thin metal vapor-deposited layer by a vapor deposition of a metal on the treated surface of the polyimide film with the heat-resistant surface treatment agent; and applying metal plating onto the metal vapor deposited layer to form a metal plated layer thereon.

REFERENCES:
patent: 4405678 (1983-09-01), Downing et al.
patent: 4710403 (1987-12-01), Krause et al.
patent: 4775556 (1988-10-01), Krause et al.
patent: 4959121 (1990-09-01), Dumas et al.
patent: 4975327 (1990-12-01), Somasiri et al.

Affiliated with

Also associated with

Rating

Process for preparing metallized polyimide film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for preparing metallized polyimide film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing metallized polyimide film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-333893