Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate
2007-08-21
2007-08-21
Padgett, Marianne (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
C427S537000, C427S569000, C427S576000, C427S099300, C427S254000
Reexamination Certificate
active
10317359
ABSTRACT:
A method for depositing metals, metal blends and alloys onto substrate surfaces, including microporous substrates utilizing a plasma operation undertaken at room temperature. In the process, a liquid solution of a monomer or comonomer precursor having a metallic component is utilized to wet the surface of the substrate, with the solvent portion thereafter being removed to leave the substrate surface coated with a dry deposit. The coated substrate is then introduced into a plasma reaction chamber with RF energy being applied across spaced electrodes to create a plasma glow along with the introduction of a plasma supporting gas. The substrate is exposed to the plasma glow for conversion of the precursor to dissociated form to create a deposit consisting essentially of the metallic component in elemental form as a cohesive film on the substrate surface. Preferred metals include such noble metals as platinum, gold and silver, as well as other metals. Preferred precursors include platinum hexafluoro-acetylacetonate, (trimethyl) methylcyclopentadienyl platinum, dimethyl(acetylacetonate) gold, and trimethyl phosphine (hexafluoroacetyl acetonate) silver.
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Conover Stephen P.
Sharma Ashok K.
AMT Holdings, Inc.
Haugen Law Firm PLLP
Padgett Marianne
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