Process for preparing integrated circuit dies for mounting

Details Process for preparing integrated circuit dies for mounting Process for preparing integrated circuit dies for mounting

1989-03-10

1990-06-05

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29885, 29412, 29413, 29414, 437226, H05K 1304

Patent

active

049302167

ABSTRACT:
Integrated circuit dies, while still in wafer form, are prepared for surface mounting direct to a substrate without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The dies are separated from each other and may be surface mounted to a substrate by soldering.

REFERENCES:
patent: 3280019 (1966-10-01), Harding et al.
patent: 4486738 (1984-12-01), Sadlo et al.
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 4640721 (1987-02-01), Uehara et al.

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