Process for preparing improved oriented polymer films and tapes

Details Process for preparing improved oriented polymer films and tapes Process for preparing improved oriented polymer films and tapes

1987-03-25

1989-08-15

Lowe, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156246, 1563082, 264204, 264280, B29D 701, B29D 900

Patent

active

048571270

ABSTRACT:
A postforming process for an oriented film or tape of polymer material, which process comprises subjecting at least one layer of such an oriented film or tape to a pressure greater than ambient pressure while heating the oriented film or tape at a temperature at which partial melting thereof occurs but which does not exceed 145.degree. C.

REFERENCES:
patent: Re31925 (1985-06-01), Jenks et al.
patent: 2067025 (1937-01-01), Schmidt
patent: 3009847 (1961-11-01), Alles et al.
patent: 3093532 (1963-06-01), Miller et al.
patent: 3767737 (1973-10-01), Lundstrom
patent: 3961122 (1976-06-01), Gaines, Jr. et al.
patent: 3997386 (1976-12-01), Oshida et al.
patent: 4089918 (1978-05-01), Kato et al.
patent: 4268470 (1981-05-01), Capaccio et al.
patent: 4403069 (1983-09-01), Keller et al.
patent: 4501856 (1985-02-01), Harpell et al.
patent: 4514351 (1985-04-01), Kaeufer et al.
patent: 4575470 (1986-03-01), Fakirov et al.
patent: 4643865 (1987-02-01), Okada et al.
Mackley and Sapsford, Techniques of Preparing High Strength, High Stiffness Polyethylene Fibres by Solution Processing, University of Cambridge, Cambridge, 1982.

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