Process for preparing epoxy laminates for additive plating

Stock material or miscellaneous articles – Composite – Of metal

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156230, 156239, 156246, 156334, 156247, 156280, 156289, 156330, 156331, 156630, 427 98, 427155, 427304, 427331, 428463, 428901, 428415, B32B 3100, B05D 512

Patent

active

042541867

ABSTRACT:
A process for preparing an epoxy impregnated laminate having an adhesive surface conductive to electroless plating wherein the adhesive surface is applied from a transfer sheet as a substantially uncured phenolic thermosetting resin
itrile rubber polymer adhesive layer which is thereafter cured by subjecting the laminate to heat and pressure curing conditions.

REFERENCES:
patent: Re28042 (1974-06-01), Rhodenizer et al.
patent: 3925138 (1975-12-01), Shaul et al.
patent: 3948701 (1976-04-01), Fasbender et al.
patent: 3955024 (1976-05-01), Goldman et al.
patent: 3956041 (1976-05-01), Polichette et al.
patent: 3989573 (1976-11-01), Sanjana
patent: 3990932 (1976-11-01), Dupire
patent: 4001466 (1977-01-01), Shaul et al.
patent: 4029845 (1977-06-01), Nomura
patent: 4100312 (1978-07-01), Lombardo et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for preparing epoxy laminates for additive plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for preparing epoxy laminates for additive plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing epoxy laminates for additive plating will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-80351

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.