Process for preparing electrical connection means, in particular

Details Process for preparing electrical connection means, in particular Process for preparing electrical connection means, in particular

1991-04-11

1993-03-16

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4273741, C23C 2600

Patent

active

051942941

ABSTRACT:
The invention relates to a process for preparing interconnection substrates of hybrid circuits, comprising effecting on a support the deposition of a thick layer of ink or paste based on a non-noble metal, such as copper or other material having a "copper compatible" formulation, by carrying out in succession a preliminary drying for eliminating solvents at a temperature on the order of 100.degree. C. to 150.degree. C., a firing comprising:

REFERENCES:
patent: 4234367 (1980-11-01), Herron
patent: 4504339 (1985-03-01), Kamehara
patent: 4622240 (1986-11-01), Yext
patent: 4627160 (1986-12-01), Herron
patent: 4885038 (1989-12-01), Anderson
patent: 4891246 (1990-01-01), McEwen
patent: 4964923 (1990-10-01), Takeuchi
patent: 4965092 (1990-10-01), Hayduk
patent: 5059450 (1991-10-01), Mellul
patent: 5071058 (1991-12-01), Nowotarski
W. Yext et al., "A Study of Various Nitrogen-Based Furnace Atmospheres and Their Effects on Copper Thick-Film Conductors and Dielectrics", Hybrid Circuit, No. 12, Jan. 1987, pp. 5-10.

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