Process for preparing a substrate for subsequent electroless dep

Details Process for preparing a substrate for subsequent electroless dep Process for preparing a substrate for subsequent electroless dep

1985-05-06

1987-01-27

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

134 28, 427 98, 427304, 427305, 427306, 427444, H05K 342

Patent

active

046393803

ABSTRACT:
A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.

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G. C. Wilson et al., "Printed Circuits: Plated Through Holes . . . ", Products Finishing, Jan. 1970, pp. 82-87.
Pridans et al., "Method for Through-Hole Plating Void Elimination", IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, p. 2267.
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