Process for preparing a semiconductor device package for analysi

Details Process for preparing a semiconductor device package for analysi Process for preparing a semiconductor device package for analysi

1999-01-08

2000-08-01

Graybill, David E.

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438124, 438690, 438977, H01L 2166, H01L 2150, H01L 21461

Patent

active

060965681

ABSTRACT:
A method for preparing a semiconductor device package for analysis of a die. The die has a back side mounted on a die paddle which is mounted to a metallic plug, and the metallic plug is disposed and supported within a cavity of a ceramic structure and is exposed on one side of the ceramic structure. A lid is attached to the ceramic structure over the cavity on the other side of the ceramic structure. The method comprises removing the lid and then filling the cavity with material to support the die. Then selected portions of the metallic plug and the die paddle are removed to expose the back side of the die.

REFERENCES:
patent: 5403752 (1995-04-01), Bruchhaus
patent: 5574285 (1996-11-01), Marion

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