Process for preparing a printed-circuit board

Details Process for preparing a printed-circuit board Process for preparing a printed-circuit board

1990-05-14

1992-04-07

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

1566591, 156902, 2041802, 430313, 430318, H05K 306, C25D 1312

Patent

active

051025191

ABSTRACT:
Disclosed is an improved process for preparing a printed-circuit board, which comprises successive steps of electrodeposition coating of a photosensitive resin on a printed-circuit base plate to form a photosensitive resist film, exposure to light through a pattern mask, development and etching, the improvement further comprising a step of dipping the photosensitive resist film formed by electrodeposition coating into an aqueous solution comprising water as a major component and applying a voltage to carry out electroendosmosis, whereby the tendency of the photosensitive resist film to stick to the pattern mask is reduced.

REFERENCES:
patent: 3492213 (1970-01-01), Johnson
patent: 3497356 (1970-02-01), Martinson
patent: 3554886 (1971-01-01), Colomb, Jr. et al.
patent: 3558741 (1971-01-01), Hotch et al.
patent: 3864230 (1975-02-01), Springer et al.
patent: 3954587 (1976-05-01), Kokawa
patent: 4024039 (1977-05-01), Yoshida et al.
patent: 4040925 (1977-08-01), McGinniss
patent: 4592816 (1986-01-01), Emmons et al.
patent: 4632900 (1986-12-01), Demmer et al.
patent: 4673458 (1987-06-01), Ishikawa et al.
patent: 4845012 (1989-07-01), Seko et al.
patent: 4985344 (1991-01-01), Uchino et al.

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