Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy
Patent
1977-09-06
1979-02-20
Lieberman, Paul
Chemistry: electrical and wave energy
Processes and products
Processes of treating materials by wave energy
20415919, 260836, 260837R, 526273, 526318, 526320, C08L 6300, C08F 246
Patent
active
041406060
ABSTRACT:
A process for preparing a polymerizable (meth) acrylate oligomer which comprises reacting an epoxide with a carboxylic acid (or anhydride thereof), at least one of said epoxide and carboxylic acid compounds containing an unsaturated alicyclic dicarboxyl group and the other containing an acryloyl group, in the presence of a metal nitrite or N-nitroso-hydroxylamine derivative. The polymerizable (meth) acrylate oligomer containing an acryloyl and an unsaturated alicyclic dicarboxyl group in the molecule is employed in coatings, adhesives, castings and the like.
REFERENCES:
patent: 3408422 (1968-10-01), May
patent: 3426063 (1969-02-01), Gros
patent: 3676524 (1972-07-01), Takiyama
patent: 3683045 (1972-08-01), Baldwin
patent: 3808114 (1974-04-01), Tsuchihara
patent: 3816278 (1974-06-01), Watt
Wako Pure Chemical Industries, Stable Unsaturated Polyesters Compositions, Chemical Abstracts vol. 82, No. 17953D, (1975) (Corresponds to Japan Kokai 74 59,892).
Toa Gosei Chemical Industry, Preventing Popcorn Polymerization of Acrylate or Methacrylate Esters; Chemical Abstracts, vol. 82, No. 40,734XK, (1975) (Corresponds to Japan Kokai 74 125,315).
Sakimoto Seiichiro
Yoshida Haruo
Lieberman Paul
Showa Denko K.K.
LandOfFree
Process for preparing a polymerizable (meth) acrylate oligomer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for preparing a polymerizable (meth) acrylate oligomer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing a polymerizable (meth) acrylate oligomer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-257297